Power Adhesives TEC Bond 14-43 14-43-043-ARA-BX10-TEC Hot Melt Adhesives Light Brown 22lb Case
Power Adhesives TEC Bond 14 is a high delivery, fast setting packaging adhesive providing an excellent bond to cardboard and paper substrates.
This hot glue also offers a low viscosity which helps minimize stringing and improves glue gun output insuring there is a minimal space in-between the surfaces you are adhering.
Specifications
- Suggested application temperature: 320ºF-380ºF
- Brookfield viscosity (POW-12-VISC) spindle 27: 2000cps @ 350ºF
- Ring & ball softening point (ASTM E28): 235ºF
- Heat resistance (BS5350 Part H3): 185ºF
- Open time: Short
- Low temperature flexibility (tg): 14ºF